Open Rack V3 Vertical Busbar
Products Description
What is the Open Rack V3 Vertical Busbar? It is a vertical power busbar designed specifically for OCP ORv3 racks. Constructed primarily from highly conductive copper, it is available with bare copper, nickel-plated, or zinc-plated finishes. Extending along the height of the rack, it provides a standardized 48V DC power distribution interface, ensuring a reliable connection between power shelves and IT equipment.
Key characteristics include a specific cross-sectional geometry compliant with OCP specifications, support for single-pole or multi-pole configurations, and current ratings ranging from hundreds to thousands of amperes; it is suitable for racks with heights of 44U to 50U.
Electrical Performance Advantages
Low-Impedance Power Transmission of OCP 48V Power Distribution System
Optimized contact resistance: Silver/nickel plating ensures contact resistance <0.3 mΩ
Increased current density: Reduces line losses by 40%–60% compared to traditional cable wiring
Voltage drop control: Total voltage drop <1% at full load, ensuring stable power supply to equipment
High Reliability Assurance for High Current Copper Busbar for Data Center
Enhanced resistance to contact welding: Copper alloying withstands transient short-circuit current surges
Arc suppression design: Break gap ≥2 mm prevents arc breakdown under abnormal operating conditions
Thermal stability: Operating temperature rise ΔT ≤45 K under continuous full-load conditions
Manufacturing Advantages
Micron-level Ultra-long Stamping
Equipped with 1,200-ton precision progressive stamping dies, the process enables the integrated forming of ultra-long bipolar copper busbars exceeding 2.2 meters, thereby avoiding the sharp rise in contact resistance associated with segmented splicing for AI Server Rack Busbar.
High-density Continuous Plating Process
A closed-loop, industrial-grade, fully automated plating line ensures uniform current density across Data Center Power Busbar Assembly during the cathode-anode exchange process. Whether applying highly corrosion-resistant electroless nickel plating over the entire surface or selective precious metal plating on contact areas, the variation in coating thickness is strictly controlled within ±10% of the target value.
High-pressure Lamination and Void-free Insulation Molding
During the composite processing of positive and negative electrodes, interlayer voids are eliminated using a constant-temperature vacuum hot press. With complete edge encapsulation of the insulation layer, the entire busbar demonstrates a partial discharge level of less than 10 pC at operating voltage, effectively eliminating the risk of arc breakdown in high-humidity and high-temperature environments for OCP 48V Power Distribution System.
Technical Features
| Electrical Performance | Supports 48V DC systems (typical range: 36–60V); current capacity is flexibly configurable based on cross-sectional area and cooling method for High Current Copper Busbar for Data Center. |
| Mechanical Characteristics | Features sufficient rigidity and flatness to ensure long-term installation stability for AI Server Rack Busbar. |
| Thermal Management Compatibility | Compatible with air-cooling or liquid-cooling expansion designs to handle high-power-density thermal loads. |
| Interface Standardization | Data Center Power Busbar Assembly complies with OCP ORv3 busbar geometry and touch-safety requirements, facilitating multi-vendor interoperability. |
contact us
To obtain full technical specifications, selection guides, sampling plans, and volume pricing for the Open Rack V3 Vertical Busbar, please contact our technical team; we can also provide compliance quality inspection reports and guidance on engineering implementation and integration.
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