Bimetal Rivet-type Contact
Products Description
Bimetal rivet-type contacts are precision electronic components that achieve a strong molecular-level bond between a silver alloy (working layer) and high-purity copper (support layer) through a cold forging process.
Heterogeneous Structure: The head (or contact surface) is made of arc-resistant and wear-resistant silver alloy, while the feet (or riveted parts) are made of copper with excellent ductility and conductivity.
Multi-functional Positioning: Suitable for both frequently actuated moving contacts and stationary contacts with fixed support.
Diverse Forms: Available in flat-head, round-head, pointed-head, and various custom-shaped sizes, perfectly adaptable to various relay springs or circuit breaker substrates.
Manufacturing Advantages: Deep Processing at a Single Interface
The core of bimetallic rivet manufacturing lies in the controlled metallurgical bonding of the silver-copper interface. We employ a solid-state diffusion pressing process, achieving atomic-level bonding between a clean silver alloy and a copper surface under precisely controlled temperature-pressure-time parameters within a protective atmosphere:
Surface Activation Treatment: Removing surface oxide films and adsorbed contaminants through electrochemical or combined mechanochemical processes exposes a fresh metal surface, reducing interfacial Bimetal rivet-type contact resistance to the micro-ohm level.
Low-Temperature Diffusion Pressing: Applying axial pressure below the silver-copper eutectic temperature promotes interfacial atomic diffusion while avoiding compositional mixing caused by liquid phase formation.
Gradient Annealing Stabilisation: The composite billet undergoes precise temperature-controlled annealing to eliminate residual interfacial stress, stabilise the diffusion layer microstructure, and enhance thermal cycling resistance.
This process system ensures that the bonding strength between the silver layer and the copper substrate exceeds the shear strength of the copper base material. Under standard riveting deformation or impact, the failure mode is always plastic deformation of the copper substrate rather than interfacial separation.
Materials Science Superiority
Silver Alloy Working Layer: Guardian of Electrical Performance
Our selected silver alloys (such as AgNi, AgSnO2, AgInO2, etc.) are prepared through internal oxidation processes or powder metallurgy, possessing extremely low contact resistance. Their core significance lies in:
Anti-welding properties: Effectively suppressing contact adhesion during high-current switching.
Arrow erosion resistance: Maintaining a smooth contact surface even after tens of thousands of operating cycles.
Copper Support Layer: The Cornerstone of Structure and Thermal Conductivity
Using high-quality electrolytic copper (T2/C1100) is significant not only for cost savings:
Excellent heat sink function: Rapidly dissipates arc heat generated at the Bi-Metal Rivets, protecting the entire switching assembly.
Superior riveting performance: Maintaining good plasticity ensures secure riveting on automated assembly lines without cracking.
Why are our bimetallic contacts trustworthy?
We not only manufacture Round Bi-Metal Electrical Contact Rivet, but also participate in early-stage design reviews for our clients. Based on your relay or switch's actual on/off conditions (current, voltage, operating frequency, ambient temperature), we can:
Recommend the most suitable silver alloy grade (AgNi, AgSnO₂, AgCdO, AgZnO, etc.);
Optimise the head shape and silver layer thickness to avoid over- or under-design.
Provide samples for lifespan comparison testing, along with temperature rise curves and Electrical Sliding Contacts resistance change data;
For high humidity or slightly corrosive environments, we can offer localised nickel plating solutions for the leads (maintaining solderability of the copper leads).
We reject a "one-size-fits-all" pricing logic-each order is individually calculated based on technical requirements, quantity, and tolerance levels to ensure you receive the optimal solution in terms of engineering feasibility and cost-effectiveness.
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Bi-metal Silver Contact Points achieve an engineering-grade balance between performance, cost, and reliability through material composites and structural optimisation, making them an indispensable key component in modern electrical systems.
For engineering-grade selection and customisation tailored to specific application scenarios (current rating, breaking frequency, or structural matching), we can provide structural optimisation and material matching solutions based on application conditions. Please submit your requirements for professional support.
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