Copper Busbar For Prismatic Cell
Products Description
Choosing our Copper Busbar for Prismatic Cell means acquiring a key component that significantly reduces system losses and enhances overall reliability. Its core advantages lie in three dimensions: conductivity efficiency, safety and stability, and ease of integration:
Superior Low Resistance Performance: High-purity copper combined with an optimized cross-section design enables efficient current transfer, reduces Joule heat generation, and improves battery system charge/discharge efficiency and energy utilization.
Long-Term Contact Reliability: Nickel or zinc plating effectively inhibits oxidation and corrosion, maintains low contact resistance, extends module service life, and reduces maintenance frequency.
Mechanical and Electrical Compatibility: A good balance of toughness and strength adapts to vibration, thermal expansion and contraction, and supports various assembly methods such as laser welding and bolt connections.
Flexible Engineering Adaptability: Highly customizable, allowing for rapid adjustments to length, width, bending angle, and hole configuration based on PACK design, shortening project integration cycles.
Material Advantages: Pushing the Limits of Conductivity and Toughness at the Crystal Lattice Level
High-Grade Oxygen-Free Copper (OFC) / Pure Copper (T2/Y2)
We select high-quality copper plates with extremely high copper content and controlled oxygen content. Extremely high purity means very few impurity grain boundaries, significantly reducing the electron scattering rate, and bringing electrical and thermal conductivity close to the theoretical limits of pure copper
Deep-Drawing High-Toughness Copper Alloy
For soft connection areas requiring complex bending and stress absorption, we use tough copper strips in a specially annealed state. BusBar High Voltages grain size is strictly controlled, exhibiting excellent elongation and fatigue strength, and it will not experience work-hardening fracture during millions of cell expansion cycles.
High-purity nickel/zinc plating raw materials
The electroplating materials are selected from a high-purity nickel aminosulfonate system and high-purity zinc ingots, which eliminates the co-deposition of organic impurities and metallic impurities, and ensures that the plating layer has low stress, high density, and low contact resistance.
Application Advantages: Covering Mainstream Power Distribution Scenarios
Photovoltaic Combiner Box
Used to combine the positive and negative currents from multiple photovoltaic strings to a unified busbar, connecting fuses and DC circuit breakers via Custom Bus Bars.
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Energy Storage Battery Clusters
Connects the positive and negative terminals of battery clusters, connecting them in parallel to a high-voltage box or PCS combiner cabinet.
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UPS Power Distribution System
Modules are connected using all-silver-plated copper bus bars, resulting in low losses and reducing the risk of cable faults in the power distribution process.
03
Server Rack Power Distribution
Serves as the backplane PDU Battery Bus Bar Connector, distributing power to each server node.
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Wind Power Converter and Inverter
Used to connect power modules and DC support capacitors.
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Manufacturing Advantages: An Agile Intelligent Manufacturing System for Gigawatt-Level Capacity
Class 100 Cleanroom Assembly and Packaging
Final inspection and packaging of telecom ground bus bars are conducted in a fully enclosed cleanroom, with workers wearing cleanroom suits. This prevents any fibers or dust from adhering to the welding or pressing surfaces, avoiding indentations and loose connections on customer production lines.
Full Lifecycle Digital Traceability
Each batch of electrolytic copper busbars corresponds to a unique QR code, with material batch, bending parameters, electroplating thickness, and appearance inspection images all uploaded to the cloud. In case of on-site quality anomalies, traceability to the source workstation and parameters is possible within seconds.
Rapid Mold Opening and Flexible Production Transfer
Relying on a strong engineering team, moldless laser/bending rapid prototyping can be achieved for simple bare copper busbars; for complex stamped parts, mold inventory has an extremely short cycle time, perfectly matching the agile development pace from customer A-sample, B-sample to SOP.
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Whether it's copper ground busbars, energy storage busbars, nickel-plated copper busbars, or high-current custom conductive structures, our engineering team can provide a one-stop conductive connection solution based on your current requirements, installation space, and system architecture, from design optimization and prototype verification to mass production.
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